TerraFill® Low Resistivity Grounding Backfill provides a simple method to substantially lower the earth resistance of grounding systems.
When used with copper grounding equipment, contact resistance to earth is lowered by up to 63%. TerraFill® produces lower steady state and stable grounding impedance, resulting in a reliable, low resistance, electrical connection between the grounding system and the earth.
ALLTEC’s TerraFill® produces lower surge impedance resulting in faster transient dissipation. Manufactured from environmentally safe and stable materials, TerraFill® has an excellent shelf life and long term storage has no performance effects.
How it Works
TerraFill® creates a reliable, low resistance electrical connection between the grounding system and the earth. It is manufactured to be compatible with copper grounding systems and standard field application methods. It can be used in connection with grounding grids to minimize step and touch potentials. In high resistivity soils, TerraFill® backfill can be used to produce acceptable grounding impedance within a reasonable sized area.